Single-Event Hardened Analog / Mixed-Signal Circuit Layouts Utilizing Node Splitting with Directional Temporal Filtering

Abstract

Transients resulting from ionizing particle strikes are a growing concern for analog and mixed signal (A/MS) circuits as technologies scale down in size. Radiation tolerant processes are a costly option and have not kept up with industry. Designers wishing to harden a system against radiation effects have instead turned to Radiation Hardening by Design (RHBD) techniques that work within the constraints of a given process to harden the system at the circuit level. This work expands on one such RHBD technique for hardening A/MS circuits known as circuit peeling, which falls under the more general heading of "hardening via node-splitting". In conjunction with peeling, a technique known as Directional Temporal Filtering (DTF) is presented which improves the effectiveness of circuit peeling and expands its applicability to additional circuit topologies. Simulation results indicate that circuit peeling with DTF can provide significant transient mitigation for a large range of A/MS sub-circuits with minimal performance penalties.